Product Introduction:

Pure copper paste printing, air sintering (120-260 degrees), extremely low resistance, supports on silicon wafers PI、PET、PP、 Printed circuits on media such as glass, ceramics, fabrics, etc.

Product Explanation:

The core material (nano copper powder) and forming technology (air sintering) that solve the bottleneck of the fourth generation integrated circuit (from subtractive manufacturing to additive manufacturing) can be adapted to different particle sizes of nano copper powder according to the thickness of the customer‘s circuit, preventing structural collapse during circuit forming. To solve the oxidation problem during the sintering process of nano copper powder from the material level, and thus achieve air sintering by bypassing the bottleneck of the laser forming equipment. Opened up channels for large-scale applications. Different organic systems are adapted to different media substrates to achieve super strong adhesion. Suitable for silicon wafer printing, replacing photovoltaic silver paste; It can also be adapted to PI and PET printing, replacing the traditional etching process of FPC and significantly reducing PCB manufacturing costs. It can also adapt to the thermal expansion of glass substrate materials, becoming the optimal solution for the packaging of next-generation TGV glass chips. It is also possible to recombine powder solutions to achieve ultra-thin battery current collectors, battery shielding (EMI) and radar absorption (PMI) coatings, thin film switches, etc.